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We are a leading Wholesale Supplier of high speed rfid bond & die cut machine from New Delhi, India.

High Speed RFID Bond & Die Cut Machine


High Speed RFID Bond & Die Cut Machine
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Product Details:
Automatic GradeAutomatic
Packaging TypeWOODEN
Size2800X1250X2350 MM
Power360v 50 hZ 20 kw

It ebsure complete  RFID chip both side or one side as well as RFID Inlay fast production. Die cut and smart tag production is available after bonding.

Speed   --    60 Meter Per Minute (Max)

Accuracy  --   + 0.3 mm

Width of chip  --  250 mm

Inner Dimention of core --  76 mm

Outer Dimension of core  -  500 mm

Function  --  RFID, Paper Composite

Weight  -  3000 KG

Additional Information:

  • Item Code: AGA-F250
  • Delivery Time: 60 DAYS
  • Packaging Details: WOODEN PACKING
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    New Delhi - 110005, Delhi, India
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